PCB deformation and placement machine is easy to use
QuICkly find and solve PCB deformation problems
PCB deformation is a common problem in SMT mass production The main reasons include: improper selection of raw materials for PCB itself, especially for paper-based PCB, whose processing temperature is too high, which will cause PCB deformation; Unreasonable PCB design components distributed unevenly will lead to excessive thermal stress on PCB and larger appearance Connectors and sockets also affect PCB expansion and contraction, and even permanent destruction; If the copper foil on one side of the PCB is too large (such as the ground wire), the copper foil on the other side will shrink Uniformity and deformation; Excessive temperature during reflow soldering will also cause PCB deformation
The solution is to select a PCB with better quality or new PCB thickness to achieve the best aspect ratio when the price and space allow; PCB shall be designed reasonably, and the area of double-sided copper foil shall be balanced. Preheat PCB; Adjust the fixture or clamping distance to ensure the thermal expansion space of PCB; Reduce the welding temperature as much as possible; When slight deformation occurs, it can be placed in the positioning fixture and heated to reset to release the stress.
Circuit board

This, in SMT processing, there is a PCB deformation problem, which must be noted in SMT batch production
Is SMT mounter easy to use?
It is mainly used for new product development and has the advantage of low price. As a very important process in the placement process, the placement machine will naturally be highly valued by manufacturers and customers. Hefei Sucheng electronic placement machine is convenient to use, but many people may not understand the development of SMT placement machine. Control key
When a device is slower than other devices, it will become a bottleneck restricting the speed improvement of the entire SMT production line. In general, the bottleneck of Hefei fast electronic placement machine often appears on the placement machine. In order to eliminate the bottleneck, it can only be achieved by adding a mounter. Under normal circumstances, we will purchase a high-speed mounter and a multi-functional mounter. Because it has both high-speed machine and high-precision characteristics, the placement range of this element includes high-precision placement machine and high-speed placement machine. It can solve the bottleneck problem caused by high-speed or high-precision mounters. At present, the development trend of SMT is also in this direction to meet the MARKet demand. Adding new mounters on the production line can solve the bottleneck problem and speed up the pace. This method provides more production capacity and more feeder positions to better balance the production line without significantly increasing the complexity of production line management, which is far greater than the new production capacity of a single mounter.
SMT reflow soldering is very important for the production process of the three kinds of SMT production equipment. The quality of products produced by the former production equipment is unqualified, while the latter production equipment cannot produce good products. Hefei Sucheng Electronic Mounter When the SMT mounter runs for a long time, some of these failures and problems will occur to the machine more or less. However, when the SMT mounter fails, the editor suggests the following ideas to solve the problem: analyze and handle the common failures of the SMT mounter. The working sequence of the placement machine and the logical relationship between them are analyzed in detail. Understand the location, contact and extent of the fault and whether there is abnormal sound. Understand the operation process before the failure occurs. Does this happen to specific placement heads and nozzles? Does it happen on a specific device? Will this happen on a specific batch? Does it happen at a particular time? Common faults of the mounting machine are: 1. The component placement offset of the smt mounter mainly refers to the position offset in the X-Y direction after the component is instalLED on the PCB. The reasons are as follows.
The more unique advantage is that it has the automatic tracking function, which can combine the production line with the product characteristics freely, and realize the integration and automation of the smt assembly line., The automation of your home mounting machine (NeoDen4) is a major feature of this product, while the labor cost of Siemens mounting machine, especially now, is increasing gradually. In this regard, people have done a lot of work in human-computer interaction. The trainer can learn how to operate the machine in half a day, which greatly saves time and labor costs. Besides personnel cost, price cost is one of the advantages. At present, the precision of the placement machine is 0.05%, but there is a certain gap with the 0.01% that can be achieved by foreign high-end equipment.
Inch length x width 0603=0.06inch * 0.03 inch, metric length x width 3216=3.2 mm * 1.6 mm 20. Exclude ERB-05604-J81 8 Code "4" indicates 4 circuits with a resistance value of 56 ohms The capacitance value of Hefei Fast Electronic Patch Electromechanical Container ECA-0105Y-M31 is C=106PF=1NF=1X10-6F 21. Full Chinese name of ECN: Engineering Change Notice; Full Chinese name of SWR: work orders with special requirements must be countersigned by relevant departments 22. The specific contents of 5S are being sorted, rectified, cleaned, cleaned and completed 23. Purpose PCB vacuum packaging is to prevent dust and moisture 24. The quality policy is: quality control, systematic implementation, and providing the quality required by customers; Fully participate, timely handle, and achieve the goal of zero defect