Process data and scattering data used in SMT
Process data used SMT patch processing
SMT processing data plays a vital role in the quality and production effICiency of products. SMT mounting processing is also calLED SMT mounting processing When designing SMT processing and establishing production line, appropriate process data must be selected according to process flow and process requirements SMT processing data include solder, solder paste, adhesive and other welding and repair data, as well as flux, cleaner, heat conversion medium and other process data Today, SMT manufacturers will introduce the main functions of assembly process data
(1) Solder and solder paste
Solder is an important structural information in surface mount process. Different types of solders are used in different applications to connect metal surfaces of welded objects and form solder joints. Reflow soldering uses solder paste, which is a kind of welding material, and its viscosity can be used to pre fix SMC/SMD.
(2) Flux
Flux is an important process information of surface assembly. It is one of the key factors affecting welding quality. It is required in various welding processes, and its main function is auxiliary welding.

(3) Adhesives
Adhesives are bonding materials in surface assembly. When the wave soldering process is used, the components are usually pre fixed on the PCB with adhesives. When assembling SMD on both sides of PCB, even if reflow soldering is used, adhesive is often applied to the center of PCB grounding pattern to strengthen the fixation of SMD and prevent SMD from shifting and falling during assembly.
(4) Detergent
The cleaner is used for surface assembly to clean the residues left on the shape memory alloy after the welding process. Under the current technical conditions, cleaning is still an indispensable part of the surface mounting process, and solvent cleaning is the most effective cleaning method.
Surface mount processing data is the basis of Surface Mount Technology. Select the corresponding assembly process data for different assembly processes and assembly programs. Sometimes in the same assembly process, the data used are different due to different subsequent processes or assembly methods.
Causes of SMT Mounter Throwing in SMT Processing
In the SMT production and processing process, it is difficult to avoid the problem of material throwing from the SMT mounter. The so-called throwing refers to that the placement machine does not paste after sucking materials during the production process, but throws materials into the throwing box or other places, or executes one of the above throwing actions without sucking materials. Throwing will cause data loss, extend production time, reduce production efficiency, and increase production costs. In order to optimize production efficiency and reduce costs, it is necessary to solve the problem of high throwing rate. Main reasons and countermeasures for dumping:
Cause 1: The suction inlet is deformed, blocked or damaged, resulting in insufficient air pressure and air leakage, leading to unqualified suction, incorrect recovery, unidentifiable and throwing.
Countermeasures: Clean and replace the nozzle;
Cause 2: The recognition system may be damaged due to problems in the recognition system, poor vision, dirty vision or laser lens, debris interference recognition, improper selection of recognition light source, insufficient intensity and gray scale.
Countermeasures: Clean and wipe the surface of the identification system, keep it clean and free of debris, adjust the intensity and gray scale of the light source, and replace the identification system components;
Cause 3: The position problem, the reclaiming is not in the data center, and the reclaiming height is incorrect (usually press down 0.05MM after contacting the parts), resulting in deviation. The reclaiming is incorrect, and there is deviation, and the identification shall be followed. The data parameters do not match, and the identified system discards them as invalid data.
Countermeasures: Adjust the reclaiming position; Cause 4: Vacuum problem, insufficient air pressure, blocked vacuum pipe channel, blocked vacuum channel by guide material or vacuum leakage, resulting in insufficient air pressure and unable to be recovered, or post it after picking it up. Fall on the road.
Countermeasures: sharply adjust the air pressure to the air pressure required by the equipment (such as 0.5~0.6Mpa -- YAMAHA mounter), clean the air pressure pipeline, and repair the air leakage channel;
Cause 5: Program problem. The component parameters in the editor are not set correctly, and they do not match the actual size, brightness and other parameters of the incoming material, which will cause the identification to fail and be discarded. Countermeasures: Modify component parameters and search for the best parameter settings of components;
Cause 6: Nonconforming products such as incoming material problems, non-standard incoming materials, pin oxidation, etc.
Countermeasures: IQC will conduct incoming material inspection and contact the component supplier; Cause 7: Feeder problems, feeder position deformation, feeder feeding defects (feeder ratchet is damaged, the belt hole on the feeder ratchet is not stuck in the feeding, there are foreign matters under the feeder, the spring is aging or power failure), resulting in materials being thrown due to picking failure or bad picking, and feeder damage.
Countermeasures: adjust the feeder, clean the feeder platform, and replace damaged parts or feeders; When discarding occurs, you can ask the field personnel first, describe it, and then directly find the problem on the basis of observation and analysis It can identify and solve problems more effectively, and improve SMT production efficiency