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鑫景福致力于滿足“快速服務(wù)，零缺陷，輔助研發(fā)”PCBA訂購(gòu)單需求。
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PCB

Reasons for circuit board delamination and its improvement

The circuit board manufacturer and the circuit board designer explain the causes of circuit board layering and its improvement

Code for Design of Circuit Board ----- Code for Design of Thick Copper Board

Circuit board manufacturers and circuit board designers explain the design specifications for thick copper plates

Six Skills for Selecting Components in Circuit Board Design

The circuit board manufacturer and the circuit board designer will explain the six techniques for selecting components in circuit board design

Anti interference Design of High Frequency Circuit Board

The circuit board manufacturer and circuit board designer explain the anti-interference design of high-frequency circuit boards

Basic principles and precautions of circuit board design

The circuit board manufacturer and circuit board designer explain the basic principles of circuit board design

Code for circuit board design of switching power supply

The circuit board manufacturer and circuit board designer explain the circuit board design specifications of switching power supply

Analysis of PCB Drawing Design Method and Key Points

This article is about the introduction of the design method and key points analysis of PCB board drawing in PCB design

PCB開路的原因及改善方法

本文介紹PCB生產(chǎn)過程中PCB開路的原因及改善方法

PCB錐孔無銅的原因分析

本文是關(guān)于PCB制造過程中PCB錐孔無銅的原因分析

Design for Manufacturability of Through Hole Plug in PCB ?

This paper introduces some DFM methods related to PCB through-hole insertion in PCB production

Wiring arrangement and reasonable layout of components on PCB

Introduction to the wiring arrangement and reasonable layout of PCB devices on the PCB board

PCB覆銅板的結(jié)構(gòu)與特點(diǎn)

一、PCB覆銅板隨著電子產(chǎn)品向輕、薄、小、高密度、多功能方向發(fā)展，印制電路板上元器件的組裝密度和集成度越來越高，功耗也越來越高， 對(duì)PCB基板的散熱要求越來越迫切。 如果基板散熱不好，會(huì)導(dǎo)致印刷電路板上元器件過熱，從而降低整機(jī)的可靠性。 在此背景下，高散熱金屬PCB基板應(yīng)運(yùn)而生。鋁基覆銅板是應(yīng)用最廣泛的金屬PCB基板。 該產(chǎn)品于1969年由日本三洋國(guó)策發(fā)明，1974年開始應(yīng)用于STK系列功率放大混合集成電路。80年代初期，我國(guó)金屬基覆銅板主要用于軍工產(chǎn)品。 當(dāng)時(shí)金屬PCB基板材料完全依賴進(jìn)口，價(jià)格昂貴。

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