專業(yè)的電路板廠家講解如何拆焊BGA芯片
電路板廠商和電路板設計師講解如何拆焊BGA芯片
電路板廠商和電路板設計師講解如何拆焊BGA芯片
The circuit board manufacturer and circuit board designer explain the PCB wiring of mobile phones
PCB problem Can BGA short circuit be caused by printing offset of solder mask of circuit board?
PCB manufacturers and PCB designers explain that increasing solder paste can improve BGA welding defects
The circuit board manufacturer and circuit board designer will explain the component packaging knowledge to you
The circuit board is often accidentally damaged during assembly or testing. Even after the PCBA is assembled, it will still be accidentally impacted by external forces. Sometimes even the copper pad on the PCB board is lifted by force and floats away.
What are the common BGA welding defects? How to handle
Requirements on peak welding temperature and melting point time of solder paste
Requirements of BGA repair equipment and characteristics of the system
PCBA焊接中,經(jīng)常出現(xiàn)BGA焊接或SMT貼片焊接問題
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